Otto Zhou Research Lab

 

Department of Physics & Astronomy

The University of North Carolina at Chapel Hill

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Zhou group awarded funding as part of NCI grant (more)

 

 

 

Facilities – Film Deposition

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  • Lamellar flow dust free hood
  • Wet etching
  • Electrophoretic deposition system

Name: Kurt J. Lesker Company PVD 75

 

Application: The Kurt J. Lesker Company PVD 75 is a versatile R&D system which can be configured to suit a variety of thin film deposition applications. The multi-technique features include sputtering, electron beam evaporation, thermal evaporation and Evaporation Furnaces (LTE Sources).  

Name: Samco RIE System, Model RIE-1C

Application: This high-performance system is engineered to optimize etching rates, uniformity and selectivity and is especially well suited for removing passivation materials for failure analysis. The RIE-1C can also be used for etching silicon based films, as well as refractory metals, metal silicides and spin-on-glass. Applications include Stripping of passivation materials including silicon nitride, silicon dioxide and silicon oxynitride, etching of intermetal dielectric with profile control, removal of residual encapsulation materials on ICs for failure analysis, stripping of photoresist and polyimide, etching silicon, polysilicon, refractory metals, metal silicides, spin-on-glass, etc.