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Otto
Zhou Research Lab
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News & Events
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Facilities – Film
Deposition |
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Application: The Kurt J. Lesker
Company PVD 75 is a versatile R&D system which can be configured to suit
a variety of thin film deposition applications. The multi-technique features
include sputtering, electron beam evaporation, thermal evaporation and Evaporation Furnaces (LTE Sources).
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Application: This high-performance system is engineered to
optimize etching rates, uniformity and selectivity and is especially well
suited for removing passivation materials for
failure analysis. The RIE-1C can also be used for etching silicon based
films, as well as refractory metals, metal silicides
and spin-on-glass. Applications include Stripping of passivation
materials including silicon nitride, silicon dioxide and silicon oxynitride, etching of intermetal
dielectric with profile control, removal of residual encapsulation materials
on ICs for failure analysis, stripping of photoresist
and polyimide, etching silicon, polysilicon,
refractory metals, metal silicides, spin-on-glass,
etc. |
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